产品介绍
镀锡添加剂
镀锡添加剂
|
产品名 Product Name |
应用 Application |
特点 Feature |
|---|---|---|
| MTHS |
▪甲基磺酸锡无铅高速半光亮添加剂 Lead-free high speed semi-bright plating ▪Reel-to-Reel电镀添加剂 Additive for Reel-to-Reel line |
▪优秀的焊锡性&均匀电沉积性 Excellent Solderability & Throwing power ▪高电流密度下的持续电沉积性 Very stable deposits on high current densities |
| MSN-2000 |
▪甲基磺酸锡无铅高速半光亮添加剂 Lead-free high speed semi-bright plating ▪Reel-to-Reel电镀添加剂 Additive for Reel-to-Reel line |
▪优秀的焊锡性&均匀电沉积性 Excellent Solderability & Throwing power ▪高电流密度下的持续电沉积性 Very stable deposits on high current densities |
各种芯片电镀
|
产品名 Product Name |
应用 Application |
特点 Feature |
|---|---|---|
| LF-500 |
▪ 各种芯片电镀 Various Chip plating |
▪ 优秀的焊锡性&均匀电沉积性 Excellent Solderability & Throwing power ▪ 出色的稳定性与宽电流密度 Very stable all over wide range of current densities |
无电解镀锡工程
|
产品名 Product Name |
应用 Application |
特点 Feature |
作业条件 | ||
|---|---|---|---|---|---|
| M/U | Temp. | Time | |||
| ITP-1000 |
▪化学镀锡 Immersion tin |
▪致密均匀的镀层组织 Dense and uniform deposit structure ▪可镀厚度达到1.5µm(0.4-1.5μm) Higher deposit thickness upto 1.5um(0.4-1.5μm) ▪优秀的浸液稳定性和焊锡性 Excellent bath stability and solderability ▪抑制锡须加长 Inhibition of whisker formation ▪不影响阻焊层 No solder-mask aggression ▪使用难度小 Easy control |
100%V | 60-70℃ | 5-25min |